[PDF] Characterization of Interconnects on Multilayer High Frequency PCB for D- Band

journal：2020 2nd 6G Wireless Summit (6G SUMMIT)

Authors：Antti Lamminen; Markku Lahti; David del Rio; Jussi Saily; Juan F. Sevillano; Vladimir Ermolov

Published date：2020-3-

DOI：10.1109/6gsummit49458.2020.9083918

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9083918

Article link：http://dx.doi.org/10.1109/6gsummit49458.2020.9083918

Article Source：IEEE。